描述
Pall purifier systems enable the removal of molecular contamination to sub-parts-per-billion (ppb) levels from a variety of gases used in the semiconductor, photovoltaic, LED and display industries. They are well suited for applications such as bulk delivery and gas bottle filling.
- Flow rates up to 4,000 slpm (141 scfm)
- Purifier assemblies contain integral particle filters
- Isolation valves allow for easy replacement of individual assemblies
- Custom configurations available to meet specific customer requirements
Products on this page may be covered by one or more patents, including US 7,465,692
Specifications
Purifiable Gases and Removal Efficiency | See Table 1 |
Materials |
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Particle Removal Rating1 |
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Housing Pressure Ratings |
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Configurations |
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Certifications |
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Leak Rating |
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1 Particle rating is based on laboratory testing with NaCl aerosol.
Table 1: List of Purifiable Gases
Gas | Purifier Material Code | Effluent Material Specification2 |
Nitrogen, argon, helium, xenon, krypton, neon | INP | <1 ppb H2O, O2, CO2 and CO |
Silane, hydrogen, methane, ethane, cyclopropane, propane, dimethyl ether | SIP | <1 ppb H2O, O2, CO2 and CO |
Carbon monoxide | SIP | <1 ppb H2O, O2, CO2, Ni(CO)4 and Fe(CO)5 |
Fluoromethane, |
FCP | <1 ppb H2O, O2, and CO2 |
Germane | GEH4P | <1 ppb H2O, O2, and CO2 |
Sulfur hexafluoride | SF6P | <1 ppb H2O, O2, and CO2 |
Air, carbon dioxide, oxygen, nitrous oxide | OXP | <10 ppb H2O |
Boron trichloride, chlorine, trichlorosilane, dichlorosilane | CLXP | <100 ppb H2O |
Hydrogen chloride | HCLP | <15 ppb H2O |
Hydrogen bromide | HBRP | <50 ppb H2O |
Photolithography clean dry air | CDAP | <1 ppb H2O, <1 ppb organics (as C4), <10 ppt acid gases (as SO2), <15 ppt basic gases (as NH3), <1 ppt refractory compounds (as HMDSO) |
2 Gas specific data available upon request.
Type
Systems
Application
Process gas purification, Process gas purification
Segments
Photovoltaics, Semiconductor, Display
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