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Gaskleen® II EL Purifier Assembly

Gaskleen® II EL Purifier Assembly

Pall Gaskleen II EL purifier assemblies are designed to remove molecular contamination from many process gases. Sub-parts-per-billion (ppb) level purification is achieved for flow rates up to 30 slpm, with excursions up to 50 slpm1, while providing ≥ 3 nanometer (nm) particle removal.

  • Controls and removes impurities such as moisture, oxygen, carbon dioxide, non-methane hydrocarbons, metal carbonyls, and siloxanes
  • 316L stainless steel housing
  • Wide variety of gases purified
  • 100% helium leak and pressure tested
  • Not orientation sensitive
  • No detectable metal contribution above background in HCl gas with HCLP materia
  • No detectable metal contribution above background in HBr gas with HBRP material
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描述

Gaskleen® II EL Purifier Assembly

Pall Gaskleen II EL purifier assemblies are designed to remove molecular contamination from many process gases. Sub-parts-per-billion (ppb) level purification is achieved for flow rates up to 30 slpm, with excursions up to 50 slpm1, while providing ≥ 3 nanometer (nm) particle removal.

  • Controls and removes impurities such as moisture, oxygen, carbon dioxide, non-methane hydrocarbons, metal carbonyls, and siloxanes
  • 316L stainless steel housing
  • Wide variety of gases purified
  • 100% helium leak and pressure tested
  • Not orientation sensitive
  • No detectable metal contribution above background in HCl gas with HCLP materia
  • No detectable metal contribution above background in HBr gas with HBRP material

Specifications

Materials
  • Housing: electropolished 316L SS
  • ≤ 0.25 μm / 10 uin Ra internal surface finish
  • Housing meets or exceeds VIM / VAR specifications
Particle Removal Efficiency Rating
  • 109 reduction for particles ≥ 3 nm up to 50 slpm2
Connections
  • ¼” Gasket Seal, Male / Male (VCR3 or compatible)
Operating Conditions
    • Maximum operating pressure : 6.9 MPa @ 100C/ 1,000 psig @ 212°F
    • Maximum operation temperature: 100°C /212°F (INP, SIP, FCP, SF6P) 40°C/ 104°F (GEH4P, OXP, CLXP, HCLP, HBRP, CDAP)
    • EU Pressure Equipment Directive: Assemblies comply with the European Union's Pressure Equipment Directive 2014/68/EU and are CE marked
Packaging
    • Double bagged
    • Aluminized outer bag, polyethylene inner bag
    • End fittings sealed with metal gaskets and caps
    • Product sealed in an argon environment

1Contact the Pall Microelectrnics group for further information.
2Particle rating based on laboratory testing with NaCl erosol.
3VCR is a trademark of Swagelok Co.

Type

Systems

Application

Process gas purification, Process gas purification

Additional Information

Technical Information

Impurity Removal as Tested in Specific Gases

Specific Gas Impurity Removal Efficiency
Inert Gases: Nitrogen, Argon, Helium, Xenon, Krypton, Neon < 1 ppb H2O, CO2, O2, and CO as tested in argon and nitrogen using APIMS analyzer
Flammable Gases: Silane, Hydrogen, Methane, Ethane, Cyclopropane, Propane, Dimethyl Ether, Ethylene, Propylene, Carbonyl Sulfide < 1 ppb H2O, CO2, O2, and CO as tested in argon, nitrogen, and hydrogen using APIMS analyzer
< 1 ppb H2O as tested in carbon monoxide using trace moisture analyzer
H2O and siloxanes removed to trace levels as tested in silane using APIMS
Carbon Monoxide < 10 ppb Ni(CO)4 and < 1 ppb Fe(CO)5 as tested in carbon monoxide using GC-ECD analyzer
Fluoromethane, Difluoromethane, Trifluoromethane, Tetrafluoroethane, Pentafluoroethane, Heptafluoropropane, Carbon Tetrafluoride, Perfluoropropane, Perfluorocyclobutane, Hexafluoroethane < 1 ppb H2O, CO2, and CO as tested in argon and nitrogen using APIMS analyzer
< 1 ppb O2 as tested in trifluoromethane using trace oxygen analyzer
< 10 ppb H2O as tested in trifluomethane using trace moisture analyzer and FTIR
Germane < 1 ppb H2O, CO2, and O2 as tested in argon using APIMS
Sulfur Hexafluoride < 1 ppb H2O, CO2, O2, and CO as tested in argon and nitrogen
Oxygenated Gases: Carbon Dioxide, Oxygen, Nitrous Oxide < 1 ppb H2O and CO2 as tested in argon using APIMS analyzer
Chlorinated Gases: Boron Trichloride, Chlorine, Trichlorosilane, Dichlorosilane < 1 ppb H2O and CO2 as tested in argon using APIMS analyzer
Hydrogen Chloride < 15 ppb H2O as tested in hydrogen chloride using CRDS
< 1 ppb H2O as tested in argon using APIMS analyzer
Hydrogen Bromide < 50 ppb H2O as tested in hydrogen bromide using CRDS
< 1 ppb H2O as tested in argon using APIMS analyzer
Photolithography Clean Dry Air < 1 ppb H2O as tested in argon using APIMS analyzer
< 300 ppt C4H8 as tested in argon using APIMS analyzer
< 10 ppt SO2 as tested in nitrogen using ion chromatograph
< 15 ppt NH3 as tested in nitrogen using ion chromatograph
< 1 ppt HMDSO as tested in argon using APIMS analyzer and baseline subtraction


Dimensions



Ordering Information

Part Numbers / Ordering Information

Part Number Specification Specific Gas Effluent Impurity Specifications
GLP6INPVMM4 Inert Gases: Nitrogen, Argon, Helium, Xenon, Krypton, Neon < 1 ppb H2O, CO2, O2, CO
GLP6SIPVMM4 Flammable Gases: Silane, Hydrogen, Methane, Ethane, Cyclopropane, Propane, Dimethyl Ether, Ethylene, Propylene, Carbonyl Sulfide Carbon Monoxide < 1 ppb H2O, CO2, O2, CO
< 1 ppb H2O, O2, CO2, Fe(CO)5 < 10 ppb Ni(CO)4
GLP6FCPVMM4 Fluoromethane, Difluoromethane, Trifluoromethane, Tetrafluoroethane, Pentafluoroethane, Heptafluoropropane, Carbon Tetrafluoride, Perfluoropropane, Perfluorocyclobutane, Hexafluoroethane < 1 ppb H2O, CO2, O2
GLP6GEH4PVMM4 Germane < 1 ppb H2O, CO2, O2, CO
GLP6SF6PVMM4 Sulfur Hexafluoride < 1 ppb H2O, CO2, O2, CO
GLP6OXPVMM4 Oxygenated Gases: Carbon Dioxide, Oxygen, Nitrous Oxide < 10 ppb H2O
GLP6CLXPVMM4 Chlorinated Gases: Boron Trichloride, Chlorine, Trichlorosilane, Dichlorosilane < 100 ppb H2O
GLP6HCLPVMM4 Hydrogen Chloride < 15 ppb H2O
GLP6HBRPVMM4 Hydrogen Bromide < 50 ppb H2O
GLP6CDAPVMM4 Photolithography clean dry air < 1 ppb H2O, < 300 ppt organics (as C4), < 10 ppt acid gases (as SO2), < 15 ppt basic gases (as NH3), < 1 ppt refractory compounds (as HMDSO)


Segments

Photovoltaics, Semiconductor, Display

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